GWEIKE Launches Integrated Ultrafast Laser Cutting Solutions for Precision Glass and Advanced Manufacturing
GWEIKE ultrafast laser glass cutting machine designed for high-precision modification and controlled splitting of thick and brittle materials.
Ultrafast laser processing enables high-precision cutting of smartphone cover glass, photovoltaic glass, and advanced brittle materials.
GWEIKE expands its ultrafast laser platform to deliver high-precision glass cutting, reduced microcracks, and stable industrial production solutions.
LOS ANGELES, CA, UNITED STATES, February 28, 2026 /EINPresswire.com/ -- GWEIKE, a global manufacturer of industrial laser systems, today announced the expansion of its ultrafast laser cutting portfolio, delivering integrated solutions for precision glass processing, brittle material machining, and high-end electronics manufacturing.
As demand grows for thinner glass, higher edge strength, and lower microcrack rates in advanced applications such as foldable displays, photovoltaic panels, and smart device cover glass, manufacturers are seeking non-thermal processing technologies that minimize material stress while improving yield consistency.
GWEIKE’s comprehensive Ultrafast Laser Cutting Machine platform provides a complete process solution from laser modification to controlled splitting, enabling manufacturers to achieve clean edges, reduced chipping, and stable mass production performance.
Addressing the Challenges of Modern Glass Processing
Traditional mechanical cutting methods often introduce edge defects, subsurface microcracks, and inconsistent break strength — particularly when processing thick or chemically strengthened glass. These issues directly affect downstream reliability and product lifespan.
Ultrafast laser processing uses picosecond or femtosecond pulse durations to create controlled internal modification zones, significantly reducing heat-affected zones and mechanical stress. When combined with optimized splitting processes, manufacturers can achieve:
Higher edge strength
Lower microcrack density
Improved yield rates
Reduced post-processing costs
Better dimensional accuracy
Detailed technical overview of ultrafast glass cutting principles and process comparisons
Integrated Platform for Industrial Production
The GWEIKE ultrafast platform supports multiple industrial configurations, including:
Thick glass cutting and splitting systems
Dual-platform front-cut back-split solutions
Precision drilling equipment for micro-hole applications
Photovoltaic glass punching systems
Roll-to-sheet laser cutting for film materials
These solutions are engineered for high-throughput production environments, enabling continuous operation with stable process windows and repeatable quality control.
“Our objective is not only to provide machines, but to deliver a complete manufacturing-grade solution,” said a spokesperson for GWEIKE. “From feasibility testing to parameter optimization and automation integration, we work closely with global manufacturers to ensure consistent production results.”
Supporting Global Manufacturing Upgrades
With rising standards in consumer electronics, renewable energy, and precision optics, manufacturers are transitioning from conventional cutting methods to ultrafast laser modification technology. GWEIKE’s solution portfolio is designed to support this transition with scalable configurations tailored to various material types and thickness ranges.
zhu Allison
Jinan GWEIKE Laser Equipment Co., Ltd.
+86 132 5337 0724
email us here
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